Material : ISOL 6, Heat Sink Compound.
Weight : Approx. 5 g.
It is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical / electronic component / device to the heat sink or chassis, there by increasing the overall efficiency of the component / device.
Features : High Thermal Conductivity Low Thermal Resistance Electrically Non-Conductive Non-Curing Non-Capacitive Non-Corrosive Bleed resistant Temp resistant from -50 to 210 C.
With a wide range working temperature, keep stable performance at temperature -30~300, suitable for adding more protection to the CPU, GPU and VGA cards.